Coating and developing apparatus, substrate processing method, and storage medium

ABSTRACT

A coating and developing apparatus is provided which requires a smaller occupation space even when it incorporates a substrate inspection unit, while eliminating a disadvantageous layout. A coating film forming part B 3  including a plurality of process units and transfer mechanisms A 3  and A 4,  and a developing part B 1  including a plurality of process units  31  and a transfer mechanism A 1  are vertically arranged in a process block S 2.  There are disposed in the process block S2 on a side of a carrier block S 1,  a plurality of vertically arranged transfer units TRS for transferring a substrate W between the same and transfer mechanisms for the respective parts, and a vertically movable transfer mechanism D 1  for the transfer unit for transferring a substrate between these transfer units. At least one of the coating film forming part and the developing part includes a substrate inspection unit  43  for inspecting a substrate transferred by the transfer mechanism for the corresponding part.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2006-112704 filed on Apr. 14,2006, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a coating and developing apparatus forcoating a substrate such as a semiconductor wafer or an LCD substrate(glass substrate for a liquid crystal display panel) with a resistliquid and developing the substrate after exposure thereof, a substrateprocessing method, and a storage medium storing a program for executingthe substrate processing method.

2. Description of Related Art

One of the processes for manufacturing a semiconductor device and an LCDsubstrate includes a series of steps in which a resist film is formed ona substrate, then the resist film is exposed with the use of aphotomask, and thereafter the resist film is developed so as to obtain adesired pattern. This process is generally performed by a systemincluding a coating and developing apparatus for coating a substratewith a resist liquid and developing the substrate, and an exposureapparatus connected to the coating and developing apparatus. Substrateson which a certain resist pattern has been formed are subjected to apredetermined inspection in which a line width of the resist pattern, anoverlapping condition of the resist pattern and a base pattern, adevelopment defect, and so on are checked for each substrate. Then, onlythe accepted substrates are transferred to the succeeding step. Thisinspection of the substrates is often conducted by a so-calledstandalone type inspecting apparatus which is separated from a coatingand developing apparatus. However, it is more convenient to employ aso-called inline system in which the coating and developing apparatusincludes a substrate inspecting apparatus.

JP2002-33266A (section 0095) describes a coating and developingapparatus employing such an inline system. As shown in FIG. 14, in theapparatus disclosed in this document, a process block (process area) P2and an interface block (interface area) P3 are connected to a carrierblock (carrier area) P1 at a rear side thereof. Further, an exposureapparatus P4 is connected to the interface block P3. The carrier blockP1 has a carrier stage 11 on which a carrier 10 containing a pluralityof substrates is placed, and a transfer arm (transfer mechanism for thecarrier block) 12 for sending a substrate to the carrier 10 placed onthe carrier stage 11 and receiving a substrate therefrom. A substratecontained in the carrier 10 is loaded into the process block P2 via thetransfer arm 12, and then a resist film is formed on the substrate inthe process block P2. Thereafter, the substrate having the resist filmformed thereon is loaded through the interface block P3 into theexposure apparatus P4 where the substrate is subjected to an exposureprocess. The exposed substrate is loaded through the interface block P3into the process block P2 where the substrate is subjected to adeveloping process. The developed substrate is received by the transferarm 12 which then transfers the same into the carrier block P1.

A substrate inspection unit 13 is disposed on a lateral side of thecarrier block P1. The developed substrate is loaded into the substrateinspection unit 13 by the transfer arm 12 via an intermediate stage 15and a special arm 14, and is subjected to the above-describedinspection. The inspected substrate is reversely delivered to thetransfer arm 12 through the reversed path, and is returned to theoriginal carrier 10.

When the substrate inspection unit 13 is connected to a block other thanthe carrier block P1, e.g., when the substrate inspection unit 13 isconnected to the interface block P3, the developed substrate has to bereturned again to the interface block P3. This structure complicates thetransfer channel of the substrate, which results in a degraded substratetransferring efficiency. Further, since the interface block P3accommodates a buffer cassette for absorbing a difference in processingspeeds of the interface block P3 and the exposure apparatus, and atemperature adjusting unit for precisely setting a temperature of thesubstrate at a temperature of the exposure apparatus, there is not anenough space for the substrate inspection unit in the process block.Thus, in order to accommodate the substrate inspection unit, theinterface block P3 has to be enlarged. Alternatively, disposition of thesubstrate inspection unit 13 in the process block P2 is disadvantageousin terms of space and transfer channel.

For these reasons, the substrate inspection unit 13 is connected to thecarrier block P1. This structure is highly advantageous in that, evenwhen the coating and developing processes are stopped for, e.g., amaintenance of the process block P2, a substrate can be loaded into thesubstrate inspection unit 13 from outside through the carrier block P1,i.e., the substrate inspection unit 13 can be independently used.

However, the substrate inspection unit 13 connected to the lateral sideof the carrier block P1 laterally protrudes therefrom. Thus, when thecoating and developing apparatus together with the substrate inspectionunit is installed in a clean room, such an installation is inefficientin the utilization of space, whereby there arises a problem regardingarrangement of a peripheral equipment and securement of a maintenancespace. In particular, when a larger substrate, e.g. a substrate such asa semiconductor wafer (referred to as “wafer” below) having a diameternot less than 12 inches is processed, the substrate inspection unit 13is necessarily enlarged, which makes the problem more serious.

JP2006-269672A discloses an example in which an inspecting block havingthe substrate inspection unit is interposed between the carrier blockand the process block. However, this layout requires a larger space forinstallation including a layout of the process block. In addition, sincea substrate transfer mechanism disposed on the inspecting block takescharge both of a transferring operation of a substrate between thecarrier block and the process block and a transferring operation of asubstrate to the inspection unit, the transfer mechanism bears anincreased burden.

SUMMARY OF THE INVENTION

The present invention has been made in view of the foregoingcircumstances. The object of the present invention is to provide acoating and developing apparatus which requires a smaller occupationspace even when it incorporates a substrate inspection unit, whileeliminating a disadvantageous layout. Another object of the presentinvention is to provide a substrate processing method and a storagemedium storing a program for executing the substrate processing method,which are capable of enhancing a throughput when the coating anddeveloping apparatus is operated to inspect a processed substrate.

A first coating and developing apparatus of the present invention is acoating and developing apparatus comprising: a process block includingcoating film forming parts each for forming a coating film on asubstrate, and a developing part for developing a substrate; a carrierblock including a transfer mechanism for the carrier block that deliversto the process block a substrate on which a coating film is to beformed, and receives the developed substrate from the process block; andan interface block that receives from the process block the substrate onwhich the coating film has been formed and delivers the substrate to anexposure apparatus, and receives an exposed substrate from the exposureapparatus and delivers the substrate to the process block; wherein thecoating film forming parts and the developing part are verticallyarranged in the process block, each of the coating film forming partsincludes: one or more liquid process unit(s) for applying a coatingliquid to a substrate; a heating process unit for heating a substrate towhich the coating liquid has been applied; and a transfer mechanism forthe coating film forming part for transferring a substrate between theseprocess units of the liquid process unit(s) and the heating processunit, at least one of the coating film forming parts including a liquidprocess unit for applying a resist liquid to a substrate, the developingpart includes a heating process unit for heating an exposed substrate, aliquid process unit for applying a developing liquid to a substrate, anda transfer mechanism for the developing part for transferring asubstrate between these process units of the liquid process unit and theheating process unit, the process block further includes: a plurality oftransfer units arranged at height positions respectively correspondingto the coating film forming parts and the developing part, a substratebeing transferred between each transfer unit and the corresponding partvia the transfer mechanism for the corresponding part; and a verticallymovable transfer mechanism for the transfer unit for transferring asubstrate between these transfer units, and at least one of the coatingfilm forming parts and the developing part further includes a substrateinspection unit for inspecting a substrate that has been transferredthereto by the transfer mechanism for the corresponding part. In thefirst coating and developing apparatus, the vertical arrangement orderof the coating film forming parts and the developing part in the processblock is not specifically limited.

In the first coating and developing apparatus of the present invention,the coating film forming part including the liquid process unit forapplying a resist liquid to a substrate may include the substrateinspection unit for inspecting a substrate on which a resist film hasbeen formed, and the developing part may include the substrateinspection unit for inspecting a developed substrate.

In addition, in the first coating and developing apparatus of thepresent invention, at least one of the transfer mechanisms for thecoating film forming part and the transfer mechanism for the developingpart may move along a path extending in the corresponding part between aside of the carrier block and a side of the interface block, the processunits may be disposed on opposite sides of the path along which thetransfer mechanism moves, and the substrate inspection unit may bedisposed at least on one of the sides of the path.

Further, in the first coating and developing apparatus of the presentinvention, the process block may further include a direct transfer partvertically stacked on the coating film forming parts and the developingpart, and the direct transfer part ma include a transfer mechanism forthe direct transfer part for directly transferring a substrate on whicha coating film has been formed in the process block from a side of thecarrier block to a side of the interface block. In the first coating anddeveloping apparatus, the vertical arrangement order of the coating filmforming parts, the developing part, and the direct transfer part in theprocess block is not specifically limited.

Further, in the first coating and developing apparatus of the presentinvention, the transfer units may be disposed on sides of the coatingfilm forming parts and the developing part such that the carrier blockis closer to the transfer units than to the coating film forming partsand the developing part, and the transfer mechanism for the carrierblock may transfer a substrate between the same and at least one of thetransfer units.

Further, in the first coating and developing apparatus of the presentinvention, the process block may include at least one second transferunit different from said transfer units, the second transfer unit beingarranged at a height position corresponding to one of the coating filmforming parts and the developing part. In the coating and developingapparatus, a transfer of a substrate between the process block and thecarrier block may be performed via the transfer units, and a transfer ofa substrate between the process block and the interface block may beperformed via the second transfer unit.

A second coating and developing apparatus of the present invention is acoating and developing apparatus comprising: a process block includingcoating film forming parts each for forming a coating film on asubstrate, a developing part for developing a substrate, and a substrateinspection part for inspecting a substrate; a carrier block including atransfer mechanism for the carrier block that delivers to the processblock a substrate on which a coating film is to be formed, and receivesthe developed substrate from the process block; and an interface blockthat receives from the process block the substrate on which the coatingfilm has been formed and delivers the substrate to an exposureapparatus, and receives an exposed substrate from the exposure apparatusand delivers the substrate to the process block; wherein the coatingfilm forming parts, the developing part, and the substrate inspectionpart are vertically arranged in the process block, each of the coatingfilm forming parts includes: one or more liquid process unit(s) forapplying a coating liquid to a substrate; a heating process unit forheating a substrate to which the coating liquid has been applied; and atransfer mechanism for the coating film forming part for transferring asubstrate between these process units of the liquid process unit(s) andthe heating process unit, at least one of the coating film forming partsincluding a liquid process unit for applying a resist liquid to asubstrate, the developing part includes a process unit having a heatingprocess unit for heating an exposed substrate, a liquid process unit forapplying a developing liquid to a substrate, and a transfer mechanismfor the developing part for transferring a substrate between theseprocess units of the liquid process unit and the heating process unit,the substrate inspection part includes a plurality of substrateinspection units for inspecting a substrate, and a transfer mechanismfor the substrate inspection part for transferring a substrate betweenthese substrate inspection units, and the process block furtherincludes: a plurality of transfer units arranged at height positionsrespectively corresponding to the coating film forming parts, thedeveloping part, and the substrate inspection part, a substrate beingtransferred between each transfer unit and the corresponding part viathe transfer mechanism for the corresponding part; and a verticallymovable transfer mechanism for the transfer unit for transferring asubstrate between these transfer units. In the second coating anddeveloping apparatus, the vertical arrangement order of the coating filmforming parts, the developing part, and the substrate inspection part inthe process block is not specifically limited.

In the second coating and developing apparatus of the present invention,the process block may further include a direct transfer part verticallystacked on the coating film forming parts, the developing part, and thesubstrate inspection part, and the direct transfer part may include atransfer mechanism for the direct transfer part for directlytransferring a substrate on which a coating film has been formed in theprocess block from a side of the carrier block to a side of theinterface block. In the second coating and developing apparatus, thevertical arrangement order of the coating film forming parts, thedeveloping part, the substrate inspection part, and the direct transferpart in the process block is not specifically limited.

In addition, in the second coating and developing apparatus of thepresent invention, the substrate inspection part may include a substrateinspection unit for inspecting a substrate on which a resist film hasbeen formed, and a substrate inspection unit for inspecting a developedsubstrate, the transfer units may be disposed on sides of the coatingfilm forming parts, the developing part, and the substrate inspectionpart such that the carrier block is closer to the transfer units than tothe coating film forming parts, the developing part, and the substrateinspection part, and a second transfer unit may be disposed on sides ofthe substrate inspection part such that the interface block is closer tothe second transfer unit than the substrate inspection part, a substratebeing transferred between the second transfer unit and the substrateinspection part, and a substrate being transferred between the secondtransfer unit and the interface block.

Further, in the second coating and developing apparatus of the presentinvention, the transfer units may be disposed on sides of the coatingfilm forming parts, the developing part, and the substrate inspectionpart such that the carrier block is closer to the coating film formingparts, the developing part, and the substrate inspection part, and thetransfer mechanism for the carrier block may transfer a substratebetween the same and at least one of the transfer units.

A first substrate processing method of the present invention is asubstrate processing method for processing a substrate with the use of acoating and developing apparatus comprising: a process block including acoating film forming part for forming a coating film on a substrate, anda developing part for developing a substrate; a carrier block from whicha substrate is transferred to the process block and to which a substrateis transferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, andthe direct transfer part are vertically arranged in the process block,each of the coating film forming part and the developing part includes aprocess unit for processing a substrate, a substrate inspection unit forinspecting a substrate, and a transfer mechanism for the correspondingpart for transferring a substrate between these units, and the processblock further includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe direct transfer part, a substrate being transferred between eachtransfer unit and the transfer mechanisms for the corresponding parts;and a transfer mechanism for the transfer unit for transferring asubstrate between these transfer units, the substrate processing methodcomprising the steps of: transferring a substrate loaded into thecarrier block to the coating film forming part of the process block;forming a resist film on the substrate in the process unit of thecoating film forming part; transferring the substrate on which theresist film has been formed by the transfer mechanism for the coatingfilm forming part to the substrate inspection unit of the coating filmforming part, and inspecting the substrate; transferring the inspectedsubstrate form the coating film forming part to the direct transfer partvia the transfer unit, and further transferring the substrate to theinterface block by means of the transfer mechanism for the directtransfer part; transferring the exposed substrate to the developing partof the process block; developing the exposed substrate in the processunit of the developing part; transferring the developed substrate by thetransfer mechanism for the developing part to the substrate inspectionunit of the developing part, and inspecting the substrate; andtransferring the inspected substrate to the carrier block. The verticalarrangement order of the coating film forming parts, the developingpart, and the direct transfer part in the process block is notspecifically limited.

A second substrate processing method of the present invention is asubstrate processing method for processing a substrate with the use of acoating and developing apparatus comprising: a process block including acoating film forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the coating film formingpart, the developing part, and the substrate inspection part arevertically arranged in the process block, each of the coating filmforming part, the developing part, and the substrate inspection partincludes a transfer mechanism for the corresponding part fortransferring a substrate in the corresponding part, and the processblock further includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe substrate inspection part, a substrate being transferred betweeneach transfer unit and the corresponding part; and a transfer mechanismfor the transfer unit for transferring a substrate between thesetransfer units, the substrate processing method comprising the steps of:transferring a substrate loaded into the carrier block to the coatingfilm forming part of the process block, and forming a resist film on thesubstrate; transferring the substrate on which the resist film has beenformed from the coating film forming part to the substrate inspectionpart via the transfer unit, and inspecting the substrate; transferringthe inspected substrate by means of the transfer mechanism for thesubstrate inspection part to a second transfer unit different from saidtransfer units, the second transfer unit being disposed on a side of theprocess unit such that the interface block is closer to the secondtransfer unit than to the process unit, and further transferring thesubstrate to the interface block via the second transfer unit;transferring the exposed substrate to the developing part of the processblock, and developing the substrate; transferring the developedsubstrate from the developing part to the substrate inspection part viathe transfer unit, and inspecting the substrate; and transferring theinspected substrate to the carrier block. The vertical arrangement orderof the coating film forming parts, the developing part, and thesubstrate inspection part is not specifically limited.

A third substrate processing method of the present invention is asubstrate processing method for processing a substrate with the use of acoating and developing apparatus comprising: a process block including acoating film forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, thesubstrate inspection part, and the direct transfer part are verticallyarranged in the process block, each of the coating film forming part,the developing part, and the substrate inspection part includes atransfer mechanism for the corresponding part for transferring asubstrate in the corresponding part, and the process block furtherincludes: a plurality of transfer units respectively corresponding tothe coating film forming part, the developing part, the substrateinspection part, and the direct transfer part, a substrate beingtransferred between each transfer unit and the corresponding part; and atransfer mechanism for the transfer unit for transferring a substratebetween these transfer units, the substrate processing method comprisingthe steps of: transferring a substrate loaded into the carrier block tothe coating film forming part of the process block, and forming a resistfilm on the substrate; transferring the substrate on which the resistfilm has been formed from the coating film forming part to the substrateinspection part via the transfer unit, and inspecting the substrate;transferring the inspected substrate from the substrate inspection partto the direct transfer part via the transfer unit, and furthertransferring the substrate to the interface block by means of thetransfer mechanism for the direct transfer part; transferring theexposed substrate to the developing part of the process block, anddeveloping the substrate; transferring the developed substrate from thedeveloping part to the substrate inspection part via the transfer unit,and inspecting the substrate; and transferring the inspected substrateto the carrier block. The vertical arrangement order of the coating filmforming parts, the developing part, the substrate inspection part, andthe direct transfer part in the process block is not specificallylimited.

A first storage medium of the present invention is a storage mediumstoring a program executed by a control device for controlling a coatingand developing apparatus comprising: a process block including a coatingfilm forming part for forming a coating film on a substrate, and adeveloping part for developing a substrate; a carrier block from which asubstrate is transferred to the process block and to which a substrateis transferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, andthe direct transfer part are vertically arranged in the process block,each of the coating film forming part and the developing part includes aprocess unit for processing a substrate, a substrate inspection unit forinspecting a substrate, and a transfer mechanism for the correspondingpart for transferring a substrate between these units, the process blockfurther includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe direct transfer part, a substrate being transferred between eachtransfer unit and the corresponding part; and a transfer mechanism forthe transfer unit for transferring a substrate between these transferunits, the storage medium executed by the control device to execute asubstrate processing method comprising the steps of: transferring asubstrate loaded into the carrier block to the coating film forming partof the process block; forming a resist film on the substrate in theprocess unit of the coating film forming part; transferring thesubstrate on which the resist film has been formed by the transfermechanism for the coating film forming part to the substrate inspectionunit of the coating film forming part, and inspecting the substrate;transferring the inspected substrate from the coating film forming partto the direct transfer part via the transfer unit, and furthertransferring the substrate to the interface block by means of thetransfer mechanism for the direct transfer part; transferring theexposed substrate to the developing part of the process block;developing the exposed substrate in the process unit of the developingpart; transferring the developed substrate by the transfer mechanism forthe developing part to the substrate inspection unit of the developingpart, and inspecting the substrate; and transferring the inspectedsubstrate to the carrier block. The vertical arrangement order of thecoating film forming parts, the developing part, and the direct transferpart in the process block is not specifically limited.

A second storage medium of the present invention is a storage mediumstoring a program executed by a control device for controlling a coatingand developing apparatus comprising: a process block including a coatingfilm forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the coating film formingpart, the developing part, and the substrate inspection part arevertically arranged in the process block, each of the coating filmforming part, the developing part, and the substrate inspection partincludes a transfer mechanism for the corresponding part fortransferring a substrate in the corresponding part, and the processblock further includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe substrate inspection part, a substrate being transferred betweeneach transfer unit and the corresponding part; and a transfer mechanismfor the transfer unit for transferring a substrate between thesetransfer units, the storage medium executed by the control device toexecute a substrate processing method comprising the steps of:transferring a substrate loaded into the carrier block to the coatingfilm forming part of the process block, and forming a resist film on thesubstrate; transferring the substrate on which the resist film has beenformed from the coating film forming part to the substrate inspectionpart via the transfer unit, and inspecting the substrate; transferringthe inspected substrate by means of the transfer mechanism for thesubstrate inspection part to a second transfer unit different from saidtransfer unit, the second transfer unit being disposed on a side of theprocess unit such that the interface block is closer to the secondtransfer unit than to the process unit, and further transferring thesubstrate to the interface block via the second transfer unit;transferring the exposed substrate to the developing part of the processblock, and developing the substrate; transferring the developedsubstrate from the developing part to the substrate inspection part viathe transfer unit, and inspecting the substrate; and transferring theinspected substrate to the carrier block. The vertical arrangement orderof the coating film forming parts, the developing parts, and thesubstrate inspection part in the process block is not specificallylimited.

A third storage medium of the present invention is a storage mediumstoring a program executed by a control device for controlling a coatingand developing apparatus comprising: a process block including a coatingfilm forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block, and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, thesubstrate inspection part, and the direct transfer part are verticallyarranged in the process block, each of the coating film forming part,the developing part, and the substrate inspection part includes atransfer mechanism for the corresponding part for transferring asubstrate in the corresponding part, and the process block furtherincludes: a plurality of transfer units respectively corresponding tothe coating film forming part, the developing part, the substrateinspection part, and the direct transfer part, a substrate beingtransferred between each transfer unit and the corresponding part; and atransfer mechanism for the transfer unit for transferring a substratebetween these transfer units, the storage medium executed by the controldevice to execute a substrate processing method comprising the steps of:transferring a substrate loaded into the carrier block to the coatingfilm forming part of the process block, and forming a resist film on thesubstrate; transferring the substrate on which the resist film has beenformed from the coating film forming part to the substrate inspectionpart via the transfer unit, and inspecting the substrate; transferringthe inspected substrate from the substrate inspection part to the directtransfer part via the transfer unit, and further transferring thesubstrate to the interface block by means of the transfer mechanism forthe direct transfer part; transferring the exposed substrate to thedeveloping part of the process block, and developing the substrate;transferring the developed substrate from the developing part to thesubstrate inspection part via the transfer unit, and inspecting thesubstrate; and transferring the inspected substrate to the carrierblock. The vertical arrangement order of the coating film forming parts,the developing part, the substrate inspection part, and the directtransfer part in the process block is not specifically limited.

According to the present invention, the substrate inspection unit isincorporated in one of the coating film forming part and the developingpart that are vertically arranged. According to another invention, thesubstrate inspection part including the substrate inspection unit isvertically arranged on the coating film forming part and the developingpart. In either of the inventions, the outward protrusion of thesubstrate inspection unit from the body of the coating and developingapparatus can be avoided. As a result, the coating and developingapparatus can have a favorable contour, and a space occupied by thecoating and developing apparatus can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a first embodiment of a coating anddeveloping apparatus of the present invention, showing a developingprocess part of the coating and developing apparatus;

FIG. 2 is a perspective view of the coating and developing apparatusshown in FIG. 1;

FIG. 3 is a vertical sectional view of the coating and developingapparatus shown in FIG. 1;

FIG. 4 is a perspective view of the developing part (DEV layer) and adirect transfer part of the coating and developing apparatus shown inFIG. 1;

FIG. 5 is a schematic view showing an example of a transfer path of asubstrate, when a substrate is processed by the coating and developingapparatus shown in FIG. 1;

FIG. 6, which corresponds to FIG. 2, is a perspective view of a secondembodiment of a coating and developing apparatus of the presentinvention;

FIG. 7, which corresponds to FIG. 3, is a side sectional view of thecoating and developing apparatus shown in FIG. 6;

FIG. 8 is a cross-sectional view of a substrate inspection part of thecoating and developing apparatus shown in FIG. 6;

FIG. 9, which corresponds to FIG. 5, is a schematic view showing anexample of a transfer path of a substrate, when a substrate is processedby the coating and developing apparatus shown in FIG. 6;

FIG. 10, which corresponds to FIG. 2, is a perspective view of a thirdembodiment of a coating and developing apparatus of the presentinvention;

FIG. 11, which corresponds to FIG. 3, is a vertical sectional view ofthe coating and developing apparatus shown in FIG. 10;

FIG. 12, which corresponds to FIG. 8, is a cross-sectional view of asubstrate inspection part of the coating and developing apparatus shownin FIG. 10;

FIG. 13, which corresponds to FIG. 5, is a schematic view showing anexample of a transfer path of a substrate, when a substrate is processedby the coating and developing apparatus shown in FIG. 10; and

FIG. 14 is a view for explaining a conventional coating and developingapparatus.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described herebelow.

A first embodiment is described with reference to FIGS. 1 to 5. FIGS. 1and 2 show a system in which an exposure apparatus is connected to adeveloping apparatus. The coating and developing apparatus 1 includes acarrier block (carrier area) S1 on which a carrier 20 capable ofhermetically containing a plurality of substrates (e.g., thirteen wafersW), a process block (process area) S2 having a plurality of, e.g., fourparts (four sections) B1 to B4 and a direct transfer part (directtransfer section) M1 arranged along a longitudinal direction of theoverall system, and an interface block (interface area) S3. An exposureapparatus S4 is connected to the interface block S3.

The carrier block S1 accommodates a table 21 on which a plurality ofcarriers 20 can be placed, opening and closing parts 22 formed in a wallsurface ahead the table 21, and a conveying arm (transfer mechanism forthe carrier block) C capable of taking out the wafer W from the carrier20 through the opening and closing part 22 and delivering the wafer W tothe carrier 20 through the opening and closing part 22. The conveyingarm C is configured to deliver the wafer W to and receive the wafer Wfrom the transfer unit TRS1 corresponding to developing parts (DEVlayers) B1 and B2, a transfer unit TRS1B corresponding to the directtransfer part M1, and a transfer unit TRS3 corresponding to a coatingfilm forming part (BCT layer) B3. To be specific, the conveying arm Ccan move in a front and rear direction and an up and down direction(vertical direction), rotate about the vertical axis, and move in adirection in which the carriers 20 are arranged.

The process block S2 surrounded by a housing 24 is connected to thecarrier block S1 at a rear side of the carrier block S1. The processblock S2 accommodates a plurality of coating film forming parts (coatingfilm forming sections) B3 and B4 each for forming a coating film on thewafer W, the developing parts (developing sections) B1 and B2 each fordeveloping the wafer W, and the direct transfer part M1 for directlytransferring the wafer W from a side of the carrier block S1 to a sideof the interface block S3. The coating film forming parts B3 and B4, thedeveloping parts B1 and B2, and the direct transfer part M1 arevertically arranged in a stacking manner. As shown in FIG. 3, in thisembodiment, the following sections are stacked in the following orderfrom the bottom. Namely, there are stacked: a first unit section(developing part: DEV layer) B1 for conducting a developing process; asecond unit section (developing part: DEV layer) B2 for conducting adeveloping process; a transfer section (direct transfer part) M1, athird unit section (coating film forming part: BCT layer) B3 for formingan antireflection film (referred to as “lower antireflection film”below) on a lower side of a resist film; and a fourth unit section(coating film forming part: COT layer) B4 for conducting an applicationprocess of a resist liquid. These unit sections B1 to B4 and thetransfer section M1 extend in the process block S2 from the side of thecarrier block S1 toward the side of the interface block 3.

The DEV layers B1 and B2 correspond to the developing parts, and the BCTlayer B3 and the COT layer B4 correspond to the coating film formingparts for forming a coating film formed of a photosensitive materialsuch as a resist. Partition plates (base members) 46 are respectivelyinterposed between the DEV layer (developing part) B2 and the directtransfer part M1, between the direct transfer part M1 and the BCT layer(coating film forming part) B3, and between the BCT layer (coating filmforming part) B3 and the COT layer (coating film forming part) B4.

Next, structures of the respective parts B (B1 to B4) will be describedbelow. In this embodiment, the respective parts B1 to B4 include manycommon portions, and the respective parts B have substantially the samelayout. At first, the DEV layers B1 and B2 are described with referenceto FIGS. 1 to 4, and then structures of other layers different fromthose of the DEV layers B1 and B2 are mainly described.

As described in FIGS. 1 to 4, a transfer path R1 for the wafer Wconnecting the carrier block S1 and the interface block S3 to each otheris formed in a center part of the DEV layer B1 in a lateral direction,more specifically, in a longitudinal direction (Y direction in thedrawings) of the DEV layers B1 and B2. Developing units 31 and 32 havinga plurality of applying parts for applying a developing liquid arevertically stacked as liquid process units along the transfer path RI ona right side thereof, when the developing unit 31 and 32 are viewed fromthe front side (the side of the carrier block S1) of the transfer pathR1. In this embodiment, the DEV layers B1 and B2 are not separated fromeach other but are integrally formed. However, as a matter ofconvenience, a horizontal section including the developing unit 31 isreferred to as the DEV layer B1, and a horizontal section including thedeveloping unit 32 is referred to as the DEV layer B2.

Each of the developing units 31 and 32 is structured as a liquid processunit for developing an exposed wafer W, and is provided with a housing30. A plurality of, e.g., three developing parts 33 are disposed in therespective housings 30. The developing part 33 includes a wafer holderfor holding and rotating the wafer W, a cup 34 surrounding the waferholder, and so on. In the developing part 33, a developing liquid issupplied from a not-shown chemical liquid nozzle to a surface of thewafer W to form thereon a liquid film of the developing liquid, so thatthe surface of the wafer W is developed. Thereafter, the developingliquid on the surface of the wafer W is washed away by means of acleaning liquid supplied from a cleaning liquid supply mechanism, notshown, and then the wafer is rotated so as to be dried. In this manner,the developing process is finished. The reference number 30 a depicts aslot through which the wafer W is transferred.

On the left side of the DEV layer B1 when viewed from the front sidethereof, there are disposed three tier-like unit groups (threestacked-rack-like unit groups) U1, U2, and U3 in this order along thetransfer path RI. The three tier-like unit groups U1, U2, and U3include, in a stacking manner, thermal process units for a heatingprocess and a cooling process that are performed before and after thewafer W is processed by the developing units 31 and 32, and aninspection unit for performing a predetermined inspection on the waferW. Namely, the developing units 31 and 32 are opposed to the tier-likeunit groups U1 to U3 with the transfer path R1 interposed therebetween.An evacuation unit 35 is disposed under the tier-like unit groups U1 toU3. The evacuation unit 35 is provided with a suction port 36 opened tothe transfer path R1. Thus, the transfer path R1 can be evacuatedthrough the suction port 36. The reference number 47 depicts a floorplate of the apparatus.

The thermal process unit includes, for example, a heating process unitfor heating the exposed wafer W and heating the developed wafer W so asto dry the same, and a cooling process unit for adjusting a temperatureof the wafer W at a predetermined one after the wafer W has beenprocessed in the heating process unit. In this embodiment, three heatingprocess units 41 are stacked to form the tier-like unit group U1, andthree cooling process units 42 are stacked to form the tier-like unitgroup U2.

The tier-like unit group U3 is composed of, e.g., two stacked substrateinspection units 43 for inspecting the developed wafer W. Each of thesubstrate inspection units 43 may be a unit of devices such as: adefective inspection device for detecting a failure and impairment inthe developing process; a foreign matter inspection device forinspecting a foreign matter on a substrate surface; a line-widthmeasuring device for measuring a line width (CD) of a pattern in aresist film formed on a substrate; an overlapping condition inspectiondevice for inspecting a precision of an overlapping condition of anexposed substrate and a photomask; a residue inspection device fordetecting a resist residue remaining on a developed substrate; and adefocus inspection device for detecting an off-position of a patterncaused by an exposure apparatus. In accordance with a desiredinspection, a suitable unit can be formed by selecting the appropriatedevices. Practically, the number of inspection units 43 and a layoutthereof are determined depending on a desired inspection and anaccommodating space therefor.

The heating process units 41, the cooling process units 42, and theinspection units 43 respectively have housings each of which is providedon its front surface facing the transfer path R1 with a transfer slot 40through which the wafer W is delivered and received.

As shown in FIG. 4, a main arm (transfer mechanism for the developingpart) A1 for transferring the wafer W in the DEV layers B1 and B2 isdisposed on the transfer path R1. The main arm A1 is configured todeliver the wafer W to and receive the wafer W from the process units 41in the tier-like unit group U1, the process units 42 in the tier-likeunit group U2, the inspection units 43 in the tier-like unit group U3,the developing units 31 and 32, the below-described tier-like unit group(first transfer unit group) U5, and the below-described tier-like unitgroup (second transfer unit group) U6. The main arm A1 has, for example,two arm members 51 and 52 each for supporting a peripheral region of therear surface of the wafer W, and a transfer base member 53 forsupporting the arm members 51 and 52. The arm members 51 and 52 areconfigured to independently move forward and rearward above the transferbase member 53. The reference numbers 54 and 55 depict guide rails forguiding the transfer base member 53. The guide rail 54 is supported bythe guide rail 55. The transfer base member 53 is capable of verticallymoving along the guide rail 54, moving along the guide rail 55, androtating about the vertical axis.

Next, the direct transfer part M1 is described with reference to FIGS.1, 3, and 4. The direct transfer part M1 is interposed between the DEVlayers B1 and B2, and the BCT layer B3. Through the direct transfer partMl, the wafer W is directly transferred from the side of the carrierblock S1 to the side of the interface block S3. The direct transfer partM1 is separated from the transfer path R1 in the DEV layers (developingparts) B1 and B2, and the transfer path R1 in the BCT layer (coatingfilm forming part) B3, by means of partition plates, respectively. Thedirect transfer part M1 includes a transfer area M2 and a shuttle arm(direct transfer mechanism) 6. For the matter of convenience, thepartition plate 46 is omitted in FIG. 4.

The shuttle arm 6 has, for example, a moving part 6A and a driving part6B. The moving part 6A is configured to move along the transfer area M2parallel to the transfer path R1, for example. The moving part 6A has,e.g., an arm member 61 for supporting a peripheral region of the rearsurface of the wafer W, the arm member 61 being capable of movingforward and rearward above a transfer base member 62. The transfer basemember 62 is disposed on a moving base member 63 such that the transferbase member 62 can rotate about the vertical axis. If a space allows, amechanism for vertically moving the transfer base member 62 can beprovided. The reference number 64 depicts a guide rail disposed on thedriving part 6B. The guide rail 64 extends along the transfer area M2and has a function to guide the moving part 6A in the lateral direction.The moving part 6A transfers the wafer W between the transfer unit TRS1Bprovided in the tier-like unit group (first transfer unit group) U5 andthe transfer unit TRS6B provided in the tier-like unit group (secondtransfer unit group) U6.

In the transfer path R1 and the transfer area M2, an area adjacent tothe carrier block S1 provides a first wafer transfer area R2. As shownin FIGS. 1 and 3, in the area R2, there are disposed the tier-like unitgroup (first transfer unit group) U5 at a position where the main armA1, the moving part 6A of the shuttle arm 6, and the conveying arm C canaccess, and a vertically movable transfer arm (transfer mechanism forthe first transfer unit) for transferring the wafer W to and from thetier-like unit group U5.

The tier-like unit group U5 includes: the transfer unit TRS1B arrangedat a height position corresponding to the direct transfer part M1; aplurality of, e.g., two transfer units TRS1 arranged at height positionscorresponding to the DEV layers B1 and B2; a plurality of, e.g., twotransfer units TRS3 arranged at height positions corresponding to theBCT layer B3; and a plurality of, e.g., two transfer units TRS4 arrangedat height positions corresponding to the COT layer B4. The conveying armC, the moving part 6A of the shuttle arm 6, and the transfer arm D1 canrespectively access the transfer unit TRS1B. The main arm A1, theconveying arm C, and the transfer arm D1 can respectively access thetransfer units TRS1.

Each of the transfer units TRS1 and the transfer unit TRS1B has ahousing of, e.g., a cuboid shape (rectangular solid shape), a tabledisposed in the housing to support the wafer W, and a pin projectablefrom the table and retractable therein. The table has a mechanism foradjusting a temperature of the wafer W supported on the table at a settemperature. The wafer is transferred among the respective transferunits via transfer slots formed in side surfaces of the housings facingthe respective arms. Specifically, each of the arms enters through thetransfer slot the housing where the wafer W is supported by a pin suchthat the wafer W is apart from the table, and picks up the wafer W fromthe rear surface thereof. Alternatively, each of the arms brings thewafer W into the housing through the transfer slot, and places the waferW on the pin projecting from the table.

As described above, the two transfer units TRS3 are arranged at heightpositions corresponding to the BCT layer B3, and the two transfer unitsTRS4 are arranged at height positions corresponding to the COT layer B4(see, FIG. 3). All the transfer units TRS3 and TRS4 have the samestructure as that of the above-described transfer units TRS1 and TRS1B.The transfer units TRS3 are configured such that the main arm A3disposed on the layer B3 and the transfer arm D1 can transfer the waferW to and from the transfer units TRS3. The transfer units TRS4 areconfigured such that the main arm A4 disposed on the layer B4 and thetransfer arm D1 can transfer the wafer W to and from the transfer unitsTRS4. In addition, the transfer units TRS3 corresponding to the BCTlayer are configured such that not only the above arms but also theconveying arm C can transfer the wafer W to and from the transfer unitsTRS3. The number of the transfer units TRS is not limited, and more thanone transfer units TRS may be disposed for each block.

The transfer arm D1 can be vertically moved to a height corresponding toeach layer. In addition, the transfer arm D1 can be moved closer to andaway from the transfer units TRS1 to TRS4 and TRS1B disposed on thecorresponding layers. Thus, the transfer arm D1 can deliver the wafer Wto and receive the wafer W from the transfer units TRS1 to TRS4 andTRS1B disposed on the corresponding layers. In this example, thetransfer units TRS1, TRS3, and TRS1B are configured such that theconveying arm C can transfer the wafer W to and from the transfer unitsTRS1, TRS3, and TRS1B.

In the transfer path R1 of the DEV layers B1 and B2 and the transferarea M2 of the direct transfer part M1, an area adjacent to theinterface block B3 provides a second wafer transfer area R3. As shown inFIG. 3, the tier-like unit group (second transfer unit group) U6 isdisposed in the area R3. In the transfer unit group U6, a transfer unitTRS6B is arranged at a height position corresponding to the directtransfer part Ml, and a transfer unit TRS6 is arranged at a heightposition corresponding to the DEV layers B1 and B2. The transfer unitTRS6B is configured such that the shuttle arm 6 and an interface arm Ican transfer the wafer W to and from the transfer unit TRS6B. Thetransfer unit TRS6 is configured such that the main arm A1 and theinterface arm I can transfer the wafer W to and from the transfer unitTRS6. The transfer units TRS6B and TRS6 have the same structure as thatof the above-described transfer units TRS1B and TRS1, for example, andhave a function for cooling the wafer W so that a temperature of thewafer W received by the transfer units TRS6B and TRS6 can be adjusted.

The interface block S3 is disposed behind the tier-like unit group U6 inthe process block S2. The interface block S3 is connected to theexposure apparatus S4. The interface block S3 has the interface arm(transfer mechanism for the interface block) I that transfers the waferW between the tier-like unit group U6 in the process block S2 and theexposure apparatus S4. The interface arm I is configured to be capableof moving forward and rearward, moving in the up and down direction, androtating about the vertical axis. The above-described transfer arm D1may be structured in the same manner as the interface arm I. However,different from the interface arm I, the transfer arm D1 can bestructured such that the transfer arm D1 cannot rotate about thevertical axis.

The interface arm I serves as a transfer mechanism for the wafer W, andis interposed between the process block S2 and the exposure apparatusS4. Namely, the interface arm I is configured to receive the wafer Wfrom the transfer unit TRS6B corresponding to the direct transfer partM1, and to deliver the received wafer W to the exposure apparatus S4. Onthe other hand, the interface arm I is also configured to receive thewafer W from the exposure apparatus S4, and to deliver the receivedwafer W to the transfer unit TRS6.

The BCT layer B3 and the COT layer B4 are briefly described below. TheBCT layer B3 and the COT layer B4 have substantially the same structureas that of the DEV layers B1 and B2. However, different from the DEVlayers B1 and B2 in which a developing liquid is used as a chemicalliquid of the liquid process unit, a chemical liquid for forming anantireflection film or a chemical liquid (resist liquid) for forming aresist film is used in the BCT layer B3 and the COT layer B4. Anapplication manner of the chemical liquid in the BCT layer B3 and theCOT layer B4 is different from the application manner in the DEV layersB1 and B2. Process conditions in heating and cooling process units inrespective tier-like unit groups in the BCT layer B3 and the COT layerB4 are also different from the process conditions in the DEV layers B1and B2. In addition, no transfer unit of the tier-like unit group U6 isdisposed on the side of the BCT layer B3 and the COT layer B4 near theinterface block S3. As shown in FIG. 3, a shielding plate 48 is disposedto separate the transfer path R1 from a region corresponding to thewafer transfer area R3.

Each of the BCT layer B3 and the COT layer B4 is provided with anevacuation unit 35. A plurality of, e.g., four tier-like unit groups aredisposed on the evacuation unit 35 along the transfer path R1. Each ofthe tier-like unit groups is composed of two vertically stacked processunits. In addition to the above-described cooling process unit andheating process unit, process units constituting the tier-like unitgroups of the COT layer B4 include a unit for making the wafer Whydrophobic, a peripheral exposure unit for exposing a periphery of thewafer W, and a substrate inspection unit for inspecting the wafer W onwhich a resist film has been formed.

Each of the substrate inspection units of the COT layer B4 may be a unitof devices such as: a defective inspection device, a film-thicknessmeasuring device for measuring a film-thickness of a resist film; aninspection device for inspecting a coating unevenness in a surface; aforeign matter inspection device for detecting particles (foreignmatter) on a substrate; a substrate deflection inspection device forobtaining data regarding a deflection in a wafer; a comet detectingdevice for detecting a comet on a surface of the resist-coated wafer W,the comet being caused by bubbles and foreign matters in a resistliquid; a splash-back detecting device for detecting a splash-back whichis a readhesion of a solvent of a resist liquid splashing from a surfaceof the wafer W; and a coating ununiformity detecting device fordetecting a coating ununiformity of a resist liquid. In accordance witha desired inspection, a suitable unit can be formed by selecting theappropriate devices.

As other process units constituting the tier-like unit group of the COTlayer B4, there can be selected a unit of process devices such as asubstrate identification title exposure device for conducting a laserprocess on the wafer W so as to create a predetermined identificationcode, and a laser ablation device for sublimating a resist covering analignment mark of the wafer W by a laser so as to expose the mark.Herein, these devices constituting a process unit are categorized as theabove-described unit for performing the predetermined inspection, andare collectively referred to as the substrate inspection unit.

The coating and developing apparatus 1 includes a control device 100formed of, e.g., a computer and having a program storing part. Theprogram storing part stores a computer program of, e.g., a software forissuing commands for executing operations of the coating and developingapparatus 1, such as process of the wafer W, transfer of the wafer W,and management of a recipe of a transfer path. The control device 100reads the program so as to control an operation of the coating anddeveloping apparatus 1. The program, which is recorded in a storagemedium such as a hard disc, a compact disc, a magnet optical disc, and amemory card, is stored in the program storing part.

An example of a method for processing a wafer W by means of the coatingand developing apparatus 1 is described below. At first, the carrier 20is loaded from outside into the carrier block S1. The conveying arm Ctakes the wafer W out of the carrier 20. The wafer W is transferred fromthe conveying arm C, to the transfer unit TRS3 of the tier-like unitgroup U5, the main arm A3 of the BCT layer B3, the cooling process unit,the main arm A3, the lower-antireflection-film forming unit (althoughnot shown, this unit is a liquid process unit corresponding to thedeveloping units 31 and 32 in FIG. 4), the main arm A3, the heatingprocess unit, the main arm A3, the cooling process unit, the main armA3, and the transfer unit TRS3 of the tier-like unit group U5, in thisorder, so that a lower antireflection film is formed on the wafer W.

Subsequently, the wafer W received by the transfer unit TRS3 istransferred to the transfer arm D1, the transfer unit TRS4 facing theCOT layer B4, the main arm A4 of the COT layer B4, the main arm A4 ofthe COT layer B4, the cooling process unit, the main arm A4, thehydrophobic process unit, the main arm A4, the cooling process unit, themain arm A4, the resist applying unit (although not shown, the unit is aliquid process unit corresponding to the developing units 31 and 32 inFIG. 4), the main arm A4, and the heating process unit, in this order,so that a resist film is formed on an upper surface of the lowerantireflection film of the wafer W. Thereafter, the wafer W istransferred by the main arm A4 to the peripheral exposure unit where aperiphery of the wafer W is exposed.

All the wafers W having their peripheries being exposed, or the wafer Wselected from these wafers W are transferred by the main arm A4 to therespective substrate inspection units of the COT layer B4, and aresequentially subjected to predetermined inspections such as aninspection for inspecting a film-thickness of the resist film and aninspection for inspection particles on a surface of the resist film.Thereafter, the wafer W is transferred by the main arm A4 to thetransfer unit TRS4 of the tier-like unit group U5. Then, the wafer W inthe transfer unit TRS4 is transferred to the transfer arm D1, thetransfer unit TRS1B, the shuttle arm 6, the transfer unit TRS6B, theinterface arm I, and the exposure apparatus S4, in this order. The waferW is subjected to a predetermined exposure process in the exposureapparatus S4.

The exposed wafer W is transferred to the interface arm I, the transferunit TRS6, the main arm A1 of the DEV layers B1 and B2, the heatingprocess unit 41, the main arm A1, the cooling process unit 42, the mainarm A1, the developing unit 31 (32), the main arm A1, the heatingprocess unit 41, the main arm A1, and the cooling process unit 42, inthis order, so that the wafer W is subjected to a predetermineddeveloping process. The thus developed wafer W is transferred by themain arm A1 to the respective substrate inspection units 43 of thetier-like unit group U3, and is sequentially subjected to predeterminedinspections. Thereafter, the inspected wafer W is transferred by themain arm A1 to the transfer unit TRS1 of the tier-like unit group U5.Then, the wafer W is returned by the conveying arm C to the originalcarrier 20 placed on the carrier block S1.

FIG. 5 schematically shows the above-described path through which thewafer W is transferred. As indicated by the chain line arrow, the waferW is moved between the coating film forming parts B3 and B4 so that acoating film is formed on the wafer W. Then, the wafer W is subjected toa predetermined pre-exposure inspection by the substrate inspection unitof the COT layer (coating film forming part) B4 (step 1). After that, asindicated by the solid line arrow, the wafer W is transferred by theshuttle arm 6 in the carrier block S2 from the side of the carrier blockS1 to the side of the interface block S3 through the direct transferpart M1, and further transferred to the exposure apparatus S4 (step 2).As indicated by the dotted line arrow, the exposed wafer W istransferred from the exposure apparatus S4 to the DEV layers (developingprocess parts) B1 and B2 where the substrate W is subjected to adeveloping process, then the substrate W is transferred to the substrateinspection unit 43 to be subjected to the above-describedpost-developing process inspection, and finally the wafer W is returnedto the carrier block S1 (step 3).

In the coating and developing apparatus 1 in this embodiment, there arevertically stacked the COT layer B4 as a unit section for applying aresist film, the COT layer B4 including the substrate inspection unit44, and the DEV layers B1 and B2 as unit sections for developing thewafer W, the DEV layers B1 and B2 including the substrate inspectionunit 43. Thus, the disadvantageous layout of the apparatus, that is tosay, the outward protrusion of the respective substrate inspection unitsfrom the body of the coating and developing apparatus can be avoided.Further, an installation space required for the coating and developingapparatus 1 can be narrowed.

The direct transfer part M1 through which the wafer W on which a resistfilm has been formed is directly transferred from the first transferunit group U5 near the carrier block S1 to the second transfer unitgroup U6 near the interface block S3 is stacked on the COT layer B4 andthe DEV layers B1 and B2. Thus, there is no need for the main arms A4,A3, and A1 of the respective COT layer B4, the BCT layer B3, and the DEVlayers B1 and B2 to transfer the wafer W toward the interface block S3.Due to this structure, loads applied to the main arms A4, A3, and A1 canbe reduced, and a transfer efficiency can be elevated, which results inan improvement in throughput.

The number of layers as the unit sections B is not limited to four, andanother unit section may be disposed for forming a coating film otherthan a lower antireflection film or a resist film. Also, the verticalarrangement order of the unit sections B1 to B4 and the direct transferpart M1 is not limited to the above order. For example, the unit area B3may be a COT layer, and the unit area B4 above the unit area B3 may be aBCT layer.

A function of the shuttle arm 6 is to directly transfer a substrate fromthe transfer unit near the carrier block to the interface block,bypassing the process unit for a coating process and the process unitfor a developing process. Even when the transfer units for a substrateare arranged in the course of the transfer path, as in theabove-described embodiment, the shuttle arm 6 is a concept including acase in which the substrate is transferred via these units between theshuttle arm 6 and the transfer mechanism in the interface block(transfer mechanism for the interface block).

Next, a second embodiment will be described with reference to FIGS. 6 to9. In FIGS. 6 to 9, the same parts as those of the first embodiment areshown by the same reference numbers, and the overlapping detaileddescription is omitted.

In a coating and developing apparatus 1 in this embodiment, a substrateinspection part B5 as a fifth unit section is stacked above a COT layerB4. FIG. 8 is a cross-sectional view of the substrate inspection part B5in the coating and applying apparatus 1. The substrate inspection partB5 has substantially the same structure as that of the respective partsB1 to B4. A different structure from the parts B1 to B4 is that thesubstrate inspection part B5 neither has a liquid process unit nor athermal process unit for a heating process or a cooling processconducted before and after a liquid process. That is to say, in thesecond embodiment, the substrate inspection units, which are placed inthe COT layer B4 and the DEV layers B1 and B2 in the first embodiment,are collectively disposed in the substrate inspection part exclusivelyused for an inspection process.

Similar to the DEV layers B1 and B2 in the above embodiment, thesubstrate inspection part B5 has tier-like unit groups U1 and U2. Eachof the tier-like unit groups U1 and U2 is composed of, e.g., two stackedsubstrate inspection units 43 which has been described above. Aplurality of units such as substrate inspection units 44 for conductingvarious inspections for a wafer W on which a resist has been applied,and a peripheral exposure unit are stacked along a transfer path R on aside opposite to the tier-like unit groups U1 and U2. The substrateinspection unit 44 corresponds to the substrate inspection unit disposedon the COT layer B4 in the above embodiment, and includes a unit ofdevices such as the above-described substrate identification titleexposure device, and the laser ablation device. Also in this embodiment,the number of substrate inspection units 43 and 44 and their layout canbe optionally determined depending on a desired inspection, aninstallation space, and so on. The arrangement is not limited to theillustrated example, as long as a main arm A5 of the substrateinspection part B5 can access the substrate inspection units 43 and 44.

A clean air for removing particles is supplied, for example, from aboveto below into the substrate inspection part B5. A pressure in thesubstrate inspection part B5 is set slightly higher than a pressure in aclean room in which the coating and developing apparatus 1 isestablished (the substrate inspection part B5 has a positive pressure).Thus, an airflow is prevented from entering the substrate inspectionpart B5 from outside, whereby particles included in the airflow can beprevented from entering the coating and developing apparatus 1.

As shown in FIG. 7, a transfer unit TRS5 is placed in a tier-like unitgroup U5 at a height position corresponding to the substrate inspectionpart B5. The main arm A5 and a transfer arm D1 can access the transferunit TRS5.

In this coating and developing apparatus 1, a wafer W is loaded into thecarrier block S1, and transferred through the same path as that of thefirst embodiment. After a lower antireflection film and a resist filmare formed on a surface of the wafer W, the wafer W is transferred to amain arm A4 of a COT layer B4, a transfer unit TRS4 of the tier-likeunit group U5, the transfer arm D1, the transfer unit TRS5, the main armA5 of the substrate inspection part B5, a peripheral exposure unit, themain arm A5, and the substrate inspection unit 44 where the wafer W issequentially subjected to predetermined inspections. Thereafter, thewafer W is transferred to the main arm A5, the transfer unit TRS5, thetransfer arm D1, a transfer unit TRS1B, a shuttle arm 6, a transfer unitTRS6B, an Interface arm I, and an exposure apparatus S4, in this order.

The wafer W that has been exposed in the exposure apparatus S4 istransferred through the same path as that of the first embodiment. Thewafer W is developed in the DEV layers B1 and B2, and is transferred tothe transfer unit TRS1. Thereafter, the wafer W is transferred to thetransfer arm D1, the transfer unit TRS5, the main arm A5, and thesubstrate inspection unit 43, in this order, and the wafer W issequentially subjected to predetermined inspections in the substrateinspection unit 43. The inspected wafer W is transferred to the main armA5, the transfer unit TRS5, the transfer arm D1, and the transfer unitTRS1, in this order, and then the wafer W is returned to a carrier 20through the same path as that of the above embodiment.

FIG. 9 is a view schematically showing a path through which the wafer Wis transferred from a film forming part to an inspection part for apost-development inspection. The wafer W is moved between coating filmforming parts B3 and B4 where a coating film is formed on the wafer W.Thereafter, as indicated by the chain line arrow, the wafer W istransferred to the substrate inspection part B5, and is subjected to apredetermined inspection before exposure in the substrate inspectionunit 44 in the substrate inspection part B5 (step 1). Then, as indicatedby the solid line arrow, the wafer W is transferred by the shuttle arm 6in a process block S2 from the side of a carrier block S1 to the side ofan interface block S3 through a direct transfer part M1, and is furthertransferred to the exposure apparatus S4 (step 2). After the wafer W isexposed, as indicated by the chain line arrow, the wafer W istransferred from the exposure apparatus S4 to the DEV layers B1 and B2where the wafer W is developed, and the wafer W is transferred to thesubstrate inspection unit 43 where the wafer W is subjected to apredetermined inspection after development (S3). After that, the wafer Wis returned to the carrier block S1.

In the coating and developing apparatus 1 in this embodiment, thesubstrate inspection part B5 having the substrate inspection units 43and 44 is vertically stacked on the COT layer B4, the DEV layers B1 andB2, and the direct transfer part MI. Therefore, similar to the firstembodiment, the disadvantageous layout of the apparatus, that is to say,the outward protrusion of the respective substrate inspection units fromthe body of the coating and developing apparatus can be avoided.Further, an installation space required for the coating and developingapparatus 1 can be narrowed.

The direct transfer part M1 through which the wafer W that has beeninspected in the substrate process part B5 is directly transferred froma first transfer unit group U5 near the carrier block S1 to a secondtransfer unit group U6 near the interface block S3 is stacked on therespective parts B1 to B5. Thus, there is no need for the main arms A1,A3, A4, and A5 of the respective parts B1 to B5 to transfer the wafer Wtoward the interface block S3. Due to this structure, loads applied tothe main arms A4, A3, and A1 can be reduced, and a transfer efficiencycan be elevated, which results in an improvement in throughput.

Next, a third embodiment will be described with reference to FIGS. 10 to12. In FIGS. 10 to 12, the same parts as those of the first and secondembodiments are shown by the same reference numbers, and the overlappingdetailed description is omitted.

A coating and developing apparatus 1 in this embodiment hassubstantially the same structure as that of the coating and developingapparatus in the second embodiment. However, the coating and developingapparatus 1 in this embodiment does not have the direct transfer partM1, the transfer unit TRS1B of the tier-like unit group U5, and thetransfer unit TRS6B of the tier-like unit group U6. FIG. 12 is across-sectional view of a substrate inspection part B5 of the coatingand developing apparatus 1 in this embodiment. As shown in FIG. 12,similar to DEV layers B1 and B2, an area of the substrate inspectionpart B5 on a side of an interface block B3 provides a wafer transferarea R3. A tier-like unit group U6 having a transfer unit TRS7 isarranged in the area R3 at a height position facing the substrateinspection part B5 of the tier-like unit group U6. A transfer arm D2having, e.g., the same structure as that of a transfer arm D1 isdisposed in the wafer transfer area R3. The transfer arm D2 canvertically move through respective parts B1 to B5, and can access thetransfer unit TRS7 and a transfer unit TRS6. In this embodiment, thetransfer arm D1 corresponds to a first transfer mechanism for the firsttransfer unit, and the transfer arm D2 corresponds to a second transfermechanism for the second transfer unit.

In the coating and developing apparatus 1, the wafer W is loaded into acarrier block S1, and transferred through the same path as that of theabove-described embodiments. After a lower antireflection film and aresist film are formed on a surface of the wafer W, the wafer W issubjected to a predetermined inspection in a substrate inspection unit44 of the substrate inspection part B5. Then, the wafer W is transferredto a main arm A5, the transfer unit TRS7, the transfer arm D2, thetransfer unit TRS6, an interface arm I, and an exposure apparatus S4, inthis order, and is exposed in the exposure apparatus S4. The exposedwafer W is returned through the same path as that of the secondembodiment to the substrate inspection part B5 through the DEV layers B1and B2, and is subjected to the above-described inspections in thesubstrate inspection unit 43. Thereafter, the wafer is returned to acarrier 20 through the same path as that of the second embodiment.

FIG. 13 is a view schematically showing a path through which the wafer Wis transferred from a film forming part to an inspection part for apost-development inspection. The wafer W is moved between the coatingfilm forming parts B3 and B4 where a coating film is formed on the waferW. Thereafter, as indicated by the chain line arrow, the wafer W istransferred to the substrate inspection part B5. In the substrateinspection unit 44 in the substrate inspection part B5, and is subjectedto a predetermined inspection before exposure in the substrateinspection unit 44 in the substrate inspection part B5 (step 1). Then,as indicated by the solid line arrow, the wafer W is transferred fromthe substrate inspection part B5 to the side of an interface block S3,and is transferred through a tier-like unit group U6 to the interfaceblock S3, and then to an exposure apparatus S4 (step 2).

As indicated by the dotted line arrow, the exposed wafer is transferredfrom the exposure apparatus S4 through the interface block S3 to the DEVlayers B1 and B2 where the wafer W is subjected to a developing process.Then, the wafer W is transferred in the DEV layers B1 and B2 to the sideof the carrier block S1. Thereafter, the wafer W is transferred again tothe substrate inspection part B5 through the tier-like unit group U5,and is subjected to the above-described inspection in the substrateinspection unit 43 of the substrate inspection part B5 (step 3). Afterthat, the wafer is returned to the carrier block S1.

Similar to the first and second embodiment, the disadvantageous layoutof the apparatus, that is to say, the outward protrusion of therespective substrate inspection units from the body of the coating anddeveloping apparatus can be avoided. Further, an installation spacerequired for the coating and developing apparatus 1 can be narrowed.

In the second and third embodiments, the vertical arrangement order ofthe respective parts B is not limited in the above-described examples.For example, the inspection block including the substrate inspectionunits 43 and 44 is disposed as an uppermost layer. However, not limitedthereto, the inspection block may be disposed as a lowermost layer, ormay be interposed between the developing parts and the coating filmforming part.

1. A coating and developing apparatus comprising: a process blockincluding coating film forming parts each for forming a coating film ona substrate, and a developing part for developing a substrate; a carrierblock including a transfer mechanism for the carrier block that deliversto the process block a substrate on which a coating film is to beformed, and receives the developed substrate from the process block; andan interface block that receives from the process block the substrate onwhich the coating film has been formed and delivers the substrate to anexposure apparatus, and receives an exposed substrate from the exposureapparatus and delivers the substrate to the process block; wherein thecoating film forming parts and the developing part are verticallyarranged in the process block, each of the coating film forming partsincludes: one or more liquid process unit(s) for applying a coatingliquid to a substrate; a heating process unit for heating a substrate towhich the coating liquid has been applied; and a transfer mechanism forthe coating film forming part for transferring a substrate between theseprocess units of the liquid process unit(s) and the heating processunit, at least one of the coating film forming parts including a liquidprocess unit for applying a resist liquid to a substrate, the developingpart includes a heating process unit for heating an exposed substrate, aliquid process unit for applying a developing liquid to a substrate, anda transfer mechanism for the developing part for transferring asubstrate between these process units of the liquid process unit and theheating process unit, the process block further includes: a plurality oftransfer units arranged at height positions respectively correspondingto the coating film forming parts and the developing part, a substratebeing transferred between each transfer unit and the corresponding partvia the transfer mechanism for the corresponding part; and a verticallymovable transfer mechanism for the transfer unit for transferring asubstrate between these transfer units, and at least one of the coatingfilm forming parts and the developing part further includes a substrateinspection unit for inspecting a substrate that has been transferredthereto by the transfer mechanism for the corresponding part.
 2. Thecoating and developing apparatus according to claim 1, wherein thecoating film forming part including the liquid process unit for applyinga resist liquid to a substrate includes the substrate inspection unitfor inspecting a substrate on which a resist film has been formed, andthe developing part includes the substrate inspection unit forinspecting a developed substrate.
 3. The coating and developingapparatus according to claim 1, wherein at least one of the transfermechanisms for the coating film forming part and the transfer mechanismfor the developing part moves along a path extending in thecorresponding part between a side of the carrier block and a side of theinterface block, the process units are disposed on opposite sides of thepath along which the transfer mechanism moves, and the substrateinspection unit is disposed at least on one of the sides of the path. 4.The coating and developing apparatus according to claim 1, wherein theprocess block further includes a direct transfer part vertically stackedon the coating film forming parts and the developing part, and thedirect transfer part includes a transfer mechanism for the directtransfer part for directly transferring a substrate on which a coatingfilm has been formed in the process block from a side of the carrierblock to a side of the interface block.
 5. The coating and developingapparatus according to claim 1, wherein the transfer units are disposedon sides of the coating film forming parts and the developing part suchthat the carrier block is closer to the transfer units than to thecoating film forming parts and the developing part, and the transfermechanism for the carrier block transfers a substrate between the sameand at least one of the transfer units.
 6. The coating and developingapparatus according to claim 1, wherein the process block includes atleast one second transfer unit different from said transfer units, thesecond transfer unit being arranged at a height position correspondingto one of the coating film forming parts and the developing part.
 7. Thecoating and developing apparatus according to claim 6, wherein atransfer of a substrate between the process block and the carrier blockis performed via the transfer units, and a transfer of a substratebetween the process block and the interface block is performed via thesecond transfer unit.
 8. A coating and developing apparatus comprising:a process block including coating film forming parts each for forming acoating film on a substrate, a developing part for developing asubstrate, and a substrate inspection part for inspecting a substrate; acarrier block including a transfer mechanism for the carrier block thatdelivers to the process block a substrate on which a coating film is tobe formed, and receives the developed substrate from the process block;and an interface block that receives from the process block thesubstrate on which the coating film has been formed and delivers thesubstrate to an exposure apparatus, and receives an exposed substratefrom the exposure apparatus and delivers the substrate to the processblock; wherein the coating film forming parts, the developing part, andthe substrate inspection part are vertically arranged in the processblock, each of the coating film forming parts includes: one or moreliquid process unit(s) for applying a coating liquid to a substrate; aheating process unit for heating a substrate to which the coating liquidhas been applied; and a transfer mechanism for the coating film formingpart for transferring a substrate between these process units of theliquid process unit(s) and the heating process unit, at least one of thecoating film forming parts including a liquid process unit for applyinga resist liquid to a substrate, the developing part includes a processunit having a heating process unit for heating an exposed substrate, aliquid process unit for applying a developing liquid to a substrate, anda transfer mechanism for the developing part for transferring asubstrate between these process units of the liquid process unit and theheating process unit, the substrate inspection part includes a pluralityof substrate inspection units for inspecting a substrate, and a transfermechanism for the substrate inspection part for transferring a substratebetween these substrate inspection units, and the process block furtherincludes: a plurality of transfer units arranged at height positionsrespectively corresponding to the coating film forming parts, thedeveloping part, and the substrate inspection part, a substrate beingtransferred between each transfer unit and the corresponding part viathe transfer mechanism for the corresponding part; and a verticallymovable transfer mechanism for the transfer unit for transferring asubstrate between these transfer units.
 9. The coating and developingapparatus according to claim 8, wherein the process block furtherincludes a direct transfer part vertically stacked on the coating filmforming parts, the developing part, and the substrate inspection part,and the direct transfer part includes a transfer mechanism for thedirect transfer part for directly transferring a substrate on which acoating film has been formed in the process block from a side of thecarrier block to a side of the interface block.
 10. The coating anddeveloping apparatus according to claim 8, wherein the substrateinspection part includes a substrate inspection unit for inspecting asubstrate on which a resist film has been formed, and a substrateinspection unit for inspecting a developed substrate, the transfer unitsare disposed on sides of the coating film forming parts, the developingpart, and the substrate inspection part such that the carrier block iscloser to the transfer units than to the coating film forming parts, thedeveloping part, and the substrate inspection part, a second transferunit is disposed on a side of the substrate inspection part such thatthe interface block is closer to the second transfer unit than to thesubstrate inspection part, a substrate being transferred between thesecond transfer unit and the substrate inspection part, and a substratebeing transferred between the second transfer unit and the interfaceblock.
 11. The coating and developing apparatus according to claim 8,wherein the transfer units are disposed on sides of the coating filmforming parts, the developing part, and the substrate inspection partsuch that the carrier block is closer to the coating film forming parts,the developing part, and the substrate inspection part, and the transfermechanism for the carrier block transfers a substrate between the sameand at least one of the transfer units.
 12. A substrate processingmethod for processing a substrate with the use of a coating anddeveloping apparatus comprising: a process block including a coatingfilm forming part for forming a coating film on a substrate, and adeveloping part for developing a substrate; a carrier block from which asubstrate is transferred to the process block and to which a substrateis transferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, andthe direct transfer part are vertically arranged in the process block,each of the coating film forming part and the developing part includes aprocess unit for processing a substrate, a substrate inspection unit forinspecting a substrate, and a transfer mechanism for the correspondingpart for transferring a substrate between these units, and the processblock further includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe direct transfer part, a substrate being transferred between eachtransfer unit and the transfer mechanisms for the corresponding parts;and a transfer mechanism for the transfer unit for transferring asubstrate between these transfer units, the substrate processing methodcomprising the steps of: transferring a substrate loaded into thecarrier block to the coating film forming part of the process block;forming a resist film on the substrate in the process unit of thecoating film forming part; transferring the substrate on which theresist film has been formed by the transfer mechanism for the coatingfilm forming part to the substrate inspection unit of the coating filmforming part, and inspecting the substrate; transferring the inspectedsubstrate form the coating film forming part to the direct transfer partvia the transfer unit, and further transferring the substrate to theinterface block by means of the transfer mechanism for the directtransfer part; transferring the exposed substrate to the developing partof the process block; developing the exposed substrate in the processunit of the developing part; transferring the developed substrate by thetransfer mechanism for the developing part to the substrate inspectionunit of the developing part, and inspecting the substrate; andtransferring the inspected substrate to the carrier block.
 13. Asubstrate processing method for processing a substrate with the use of acoating and developing apparatus comprising: a process block including acoating film forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the coating film formingpart, the developing part, and the substrate inspection part arevertically arranged in the process block, each of the coating filmforming part, the developing part, and the substrate inspection partincludes a transfer mechanism for the corresponding part fortransferring a substrate in the corresponding part, and the processblock further includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe substrate inspection part, a substrate being transferred betweeneach transfer unit and the corresponding part; and a transfer mechanismfor the transfer unit for transferring a substrate between thesetransfer units, the substrate processing method comprising the steps of:transferring a substrate loaded into the carrier block to the coatingfilm forming part of the process block, and forming a resist film on thesubstrate; transferring the substrate on which the resist film has beenformed from the coating film forming part to the substrate inspectionpart via the transfer unit, and inspecting the substrate; transferringthe inspected substrate by means of the transfer mechanism for thesubstrate inspection part to a second transfer unit different from saidtransfer units, the second transfer unit being disposed on a side of theprocess unit such that the interface block is closer to the secondtransfer unit than to the process unit, and further transferring thesubstrate to the interface block via the second transfer unit;transferring the exposed substrate to the developing part of the processblock, and developing the substrate; transferring the developedsubstrate from the developing part to the substrate inspection part viathe transfer unit, and inspecting the substrate; and transferring theinspected substrate to the carrier block.
 14. A substrate processingmethod for processing a substrate with the use of a coating anddeveloping apparatus comprising: a process block including a coatingfilm forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block; and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, thesubstrate inspection part, and the direct transfer part are verticallyarranged in the process block,. each of the coating film forming part,the developing part, and the substrate inspection part includes atransfer mechanism for the corresponding part for transferring asubstrate in the corresponding part, and the process block furtherincludes: a plurality of transfer units respectively corresponding tothe coating film forming part, the developing part, the substrateinspection part, and the direct transfer part, a substrate beingtransferred between each transfer unit and the corresponding part; and atransfer mechanism for the transfer unit for transferring a substratebetween these transfer units, the substrate processing method comprisingthe steps of: transferring a substrate loaded into the carrier block tothe coating film forming part of the process block, and forming a resistfilm on the substrate; transferring the substrate on which the resistfilm has been formed from the coating film forming part to the substrateinspection part via the transfer unit, and inspecting the substrate;transferring the inspected substrate from the substrate inspection partto the direct transfer part via the transfer unit, and furthertransferring the substrate to the interface block by means of thetransfer mechanism for the direct transfer part; transferring theexposed substrate to the developing part of the process block, anddeveloping the substrate; transferring the developed substrate from thedeveloping part to the substrate inspection part via the transfer unit,and inspecting the substrate; and transferring the inspected substrateto the carrier block.
 15. A storage medium storing a program executed bya control device for controlling a coating and developing apparatuscomprising: a process block including a coating film forming part forforming a coating film on a substrate, and a developing part fordeveloping a substrate; a carrier block from which a substrate istransferred to the process block and to which a substrate is transferredfrom the process block; and an interface block to which a substrate istransferred from the process block and from which a substrate istransferred to the process block, the interface block being connected toan exposure apparatus; wherein the process block further includes adirect transfer part having a transfer mechanism for the direct transferpart for directly transferring a substrate in the process block betweena side of the carrier block and a side of the interface block, thecoating film forming part, the developing part, and the direct transferpart are vertically arranged in the process block, each of the coatingfilm forming part and the developing part includes a process unit forprocessing a substrate, a substrate inspection unit for inspecting asubstrate, and a transfer mechanism for the corresponding part fortransferring a substrate between these units, the process block furtherincludes: a plurality of transfer units respectively corresponding tothe coating film forming part, the developing part, and the directtransfer part, a substrate being transferred between each transfer unitand the corresponding part; and a transfer mechanism for the transferunit for transferring a substrate between these transfer units, thestorage medium executed by the control device to execute a substrateprocessing method comprising the steps of: transferring a substrateloaded into the carrier block to the coating film forming part of theprocess block; forming a resist film on the substrate in the processunit of the coating film forming part; transferring the substrate onwhich the resist film has been formed by the transfer mechanism for thecoating film forming part to the substrate inspection unit of thecoating film forming part, and inspecting the substrate; transferringthe inspected substrate from the coating film forming part to the directtransfer part via the transfer unit, and further transferring thesubstrate to the interface block by means of the transfer mechanism forthe direct transfer part; transferring the exposed substrate to thedeveloping part of the process block; developing the exposed substratein the process unit of the developing part; transferring the developedsubstrate by the transfer mechanism for the developing part to thesubstrate inspection unit of the developing part, and inspecting thesubstrate; and transferring the inspected substrate to the carrierblock.
 16. A storage medium storing a program executed by a controldevice for controlling a coating and developing apparatus comprising: aprocess block including a coating film forming part for forming acoating film on a substrate, a developing part for developing asubstrate, and a substrate inspection part for inspecting a substrate; acarrier block from which a substrate is transferred to the process blockand to which a substrate is transferred from the process block; and aninterface block to which a substrate is transferred from the processblock and from which a substrate is transferred to the process block,the interface block being connected to an exposure apparatus; whereinthe coating film forming part, the developing part, and the substrateinspection part are vertically arranged in the process block, each ofthe coating film forming part, the developing part, and the substrateinspection part includes a transfer mechanism for the corresponding partfor transferring a substrate in the corresponding part, and the processblock further includes: a plurality of transfer units respectivelycorresponding to the coating film forming part, the developing part, andthe substrate inspection part, a substrate being transferred betweeneach transfer unit and the corresponding part; and a transfer mechanismfor the transfer unit for transferring a substrate between thesetransfer units, the storage medium executed by the control device toexecute a substrate processing method comprising the steps of:transferring a substrate loaded into the carrier block to the coatingfilm forming part of the process block, and forming a resist film on thesubstrate; transferring the substrate on which the resist film has beenformed from the coating film forming part to the substrate inspectionpart via the transfer unit, and inspecting the substrate; transferringthe inspected substrate by means of the transfer mechanism for thesubstrate inspection part to a second transfer unit different from saidtransfer unit, the second transfer unit being disposed on a side of theprocess unit such that the interface block is closer to the secondtransfer unit than to the process unit, and further transferring thesubstrate to the interface block via the second transfer unit;transferring the exposed substrate to the developing part of the processblock, and developing the substrate; transferring the developedsubstrate from the developing part to the substrate inspection part viathe transfer unit, and inspecting the substrate; and transferring theinspected substrate to the carrier block.
 17. A storage medium storing aprogram executed by a control device for controlling a coating anddeveloping apparatus comprising: a process block including a coatingfilm forming part for forming a coating film on a substrate, adeveloping part for developing a substrate, and a substrate inspectionpart for inspecting a substrate; a carrier block from which a substrateis transferred to the process block and to which a substrate istransferred from the process block, and an interface block to which asubstrate is transferred from the process block and from which asubstrate is transferred to the process block, the interface block beingconnected to an exposure apparatus; wherein the process block furtherincludes a direct transfer part having a transfer mechanism for thedirect transfer part for directly transferring a substrate in theprocess block between a side of the carrier block and a side of theinterface block, the coating film forming part, the developing part, thesubstrate inspection part, and the direct transfer part are verticallyarranged in the process block, each of the coating film forming part,the developing part, and the substrate inspection part includes atransfer mechanism for the corresponding part for transferring asubstrate in the corresponding part, and the process block furtherincludes: a plurality of transfer units respectively corresponding tothe coating film forming part, the developing part, the substrateinspection part, and the direct transfer part, a substrate beingtransferred between each transfer unit and the corresponding part; and atransfer mechanism for the transfer unit for transferring a substratebetween these transfer units, the storage medium executed by the controldevice to execute a substrate processing method comprising the steps of:transferring a substrate loaded into the carrier block to the coatingfilm forming part of the process block, and forming a resist film on thesubstrate; transferring the substrate on which the resist film has beenformed from the coating film forming part to the substrate inspectionpart via the transfer unit, and inspecting the substrate; transferringthe inspected substrate from the substrate inspection part to the directtransfer part via the transfer unit, and further transferring thesubstrate to the interface block by means of the transfer mechanism forthe direct transfer part; transferring the exposed substrate to thedeveloping part of the process block, and developing the substrate;transferring the developed substrate from the developing part to thesubstrate inspection part via the transfer unit, and inspecting thesubstrate; and transferring the inspected substrate to the carrierblock.